Lead free solder containing Sn, Ag and Bi
US7670548B2 · kind B2 · utility
1Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2008 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Jan 29, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/0222
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.