Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device
US7670884B2 · kind B2 · utility
9Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2008 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Nov 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer; forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.