Cloverleaf microgyroscope with through-wafer interconnects and method of manufacturing a cloverleaf microgyroscope with through-wafer interconnects
US7671431B1 · kind B1 · utility
1Cited by
25References
26Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 10, 2006 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Jun 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising: attaching a post wafer to a resonator wafer, forming a bottom post from the post wafer being attached to the resonator wafer, preparing a base wafer with through-wafer interconnects, attaching the resonator wafer to the base wafer, wherein the bottom post fits into a post hole in the base wafer, forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, and attaching a cap wafer on top of the base wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.