Apparatus and method for cold sparing in multi-board computer systems
US7673186B2 · kind B2 · utility
2Cited by
5References
34Claims
0Family size
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Inventor
Key dates
| Filing date | Jun 7, 2006 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Apr 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Power supply voltage of a PCI or a similar communication bus interface is separated from one or more other power supply voltages on a backplane, on boards insertable into the backplane, and on the bus interface components of the boards. The power supply of the bus interface (VIO) is provided to cold spare boards inserted into the backplane, while the other voltages are not provided to the cold spare boards. Availability of the VIO on the cold spare boards prevents the VIO clamping diodes on the PCI I/O lines from grounding the PCI bus. Cold spare capability is thus provided to systems with PCI and similar communication buses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.