Positive photosensitive resin composition
US7674566B2 · kind B2 · utility
4Cited by
2References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 20, 2006 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Feb 20, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0233
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a positive photosensitive resin composition, characterized by comprising 1 to 50 parts by mass of a photo-acid generator and 0.01 to 70 parts by mass of a terpene compound in combination with 100 parts by mass of a hydroxypolyamide having repeating units. A terpene compound can be combined with a hydroxypolyamide having a particular structure to provide a positive photosensitive resin composition excellent in positive lithography performance such as sensitivity and resolution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.