Radio frequency identification (RFID) tag lamination process using liner
US7674649B2 · kind B2 · utility
1Cited by
27References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2008 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Aug 6, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.