Adjuvant for chemical mechanical polishing slurry
US7674716B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2005 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Apr 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is an adjuvant for use in simultaneous polishing of a cationically charged material and an anionically charged material, which forms a adsorption layer on the cationically charged material in order to increase the polishing selectivity of the anionically charged material to cationically charged material, wherein the adjuvant comprises a polyelectrolyte salt containing: (a) a graft type polyelectrolyte that has a weight average molecular weight of 1,000˜20,000 and comprises a backbone and a side chain; and (b) a basic material. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.