Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection
US7675166B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2005 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Feb 2, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.