Patent · US Active

Method of processing a circuit board

US7676920B2 · kind B2 · utility

11Cited by

6References

9Claims

0Family size

Assignee

Dell Products L.P. · US

Inventors

Sandor Farkas · Round Rock, US
Hector Martinez · San Leandro, US
Bhavesh Govindbhai Patel · Austin, US
Indrani Paul · Round Rock, US
Larry P. Robison, Jr. · Pflugerville, US
Darrell J. Slupek · Austin, US
Aubrey K. Sparkman · Austin, US

Key dates

Filing date	Oct 16, 2006
Grant date	Mar 16, 2010
Priority date	—
Expiry date	Sep 11, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49165
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A test coupon on a printed circuit board used for verifying that vias in the printed circuit board are back drilled to a proper predetermined depth. Use of the coupon involves correlating a via on the board to a via of a test coupon drilling the board via and the test coupon via to substantially the same depth, where the depth is predetermined based on the board via. Then measuring the impedance of the test coupon to reveal the actual depth of the back drilling of the coupon via. Knowing the actual back drill depth of the coupon via is used to verify the back drill depth of the board via.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.