Pb-free copper-alloy sliding material
US7678173B2 · kind B2 · utility
3Cited by
1References
6Claims
0Family size
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Key dates
| Filing date | Jan 13, 2005 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | May 17, 2025 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C2204/18
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In a Pb-free copper-based sintered alloy containing from 1 to 30% of Bi and from 0.1 to 10% of hard matter particles having from 10 to 50 μm of average particle diameter, the Bi phase has a smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix, or the hard matter particles having 50% or less of a contact length ratio with the Bi phase based on the total circumferential length of the hard particle, which are in contact with said Bi phase, are present in a ratio of 70% or more based on the entire number of the hard matter particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.