Process for finishing a wooden board and wooden board produced by the process
US7678425B2 · kind B2 · utility
21Cited by
270References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2004 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Oct 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31989
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A process for finishing a wood or wooden board, in particular an MDF or HDF board, with an upper side and an underside. The process includes applying a sealing layer of melamine resin to the upper side of the board and printing a decoration onto the sealing layer. A protective layer is applied of melamine resin to the decoration and the board is pressed under the action of temperature until the protective layer and the sealing layer melt and bond to each other with the inclusion of the decoration printed on.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.