Positive-type photosensitive resin composition, cured film, protecting film, insulating film and semiconductor device and display device using these films
US7678514B2 · kind B2 · utility
1Cited by
4References
12Claims
0Family size
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Key dates
| Filing date | Dec 24, 2008 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Dec 24, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0046
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1),wherein R1 and R2 represent alkyl groups having 1 to 10 carbon atoms, R3 represents an organic group, and R4 represents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.