Method for fabricating a recessed ohmic contact for a PHEMT structure

US7678629B1 · kind B1 · utility

Assignee

• Skyworks Solutions, Inc. · US

Inventors

• Jerod F. Mason · Bedford, US
• Dylan Charles Bartle · Arlington, US

Key dates

• Filing date: Jul 9, 2007
• Grant date: Mar 16, 2010
• Expiry date: Jul 9, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D64/62

Abstract

According to an exemplary embodiment, a PHEMT (pseudomorphic high electron mobility transistor) structure includes a conductive channel layer. The PHEMT structure further includes at least one doped layer situated over the conductive channel layer. The at least one doped layer can include a heavily doped layer situated over a lightly doped layer. The PHEMT structure further includes a recessed ohmic contact situated on the conductive channel layer, where the recessed ohmic contact is situated in a source/drain region of the PHEMT structure, and where the recessed ohmic contact extends below the at least one doped layer. According to this exemplary embodiment, the recessed ohmic contact is bonded to the conductive channel layer. The recessed ohmic contact is situated adjacent to the at least one doped layer. The PHEMT structure further includes a spacer layer situated between the at least one doped layer and the conductive channel layer.