Method and system for extracting heat from electrical components
US7679916B2 · kind B2 · utility
17Cited by
29References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2006 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Dec 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/064
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.