Electronic assembly cooling
US7679917B2 · kind B2 · utility
5Cited by
9References
20Claims
0Family size
Inventors
Key dates
| Filing date | Jan 25, 2008 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Feb 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly including a first heat producing device mounted on a first outer surface of a first portion of a circuit board. The first portion can deflect upwardly and downwardly relative to other portions of the circuit board. A first force element urges the first heat producing device against a heat sink. The force exerted by the first force element is variable with respect to time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.