System for processing semiconductor substrate by using laser and method of the same
US7680557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2004 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Jan 2, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
The present invention provides a system for processing a semiconductor substrate using a laser beam, the system including: a storing unit storing a process control data set for a slot for loading the semiconductor substrate therein; a process controlling unit detecting identification information of the slot in which the semiconductor substrate is loaded, and reading the control data, which is set for the detected identification information, from the storing unit to control a process of the semiconductor substrate; and a substrate processing unit processing the semiconductor substrate on the basis of the read control data using the laser beam with a predetermined energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.