Primary shaping method for a component comprising a microstructured functional element
US7681627B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2005 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Sep 28, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method is disclosed for molding a component with at least one microstructured functional element, which is configured intentionally with a defined structure, in relief, at a defined point on the surface of the component in order to specifically fulfill a function. The element has a characteristic dimension in the micrometer range in at least one spatial direction. The component is shaped from a substantially metallic material using a mould. At least one functional element is formed in a negative impression that is configured on the surface of the mould.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.