Patent · US Expired

Primary shaping method for a component comprising a microstructured functional element

US7681627B2 · kind B2 · utility

8Cited by
6References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 28, 2005
Grant dateMar 23, 2010
Priority date
Expiry dateSep 28, 2025

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB33Y80/00
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method is disclosed for molding a component with at least one microstructured functional element, which is configured intentionally with a defined structure, in relief, at a defined point on the surface of the component in order to specifically fulfill a function. The element has a characteristic dimension in the micrometer range in at least one spatial direction. The component is shaped from a substantially metallic material using a mould. At least one functional element is formed in a negative impression that is configured on the surface of the mould.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.