Backlight module with a heat dissipation device
US7682047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2007 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Apr 24, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133628
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A backlight module including a light box, a plurality of light source sets, and a heat dissipation device is provided. The light box has a bottom and a light-emitting section. The bottom has a first surface and a second surface opposite to the first surface. The light source sets are disposed on the first surface, and each of the light source sets includes a substrate disposed on the first surface and a plurality of point light sources disposed on the substrate. The heat dissipation device is disposed on the second surface. The heat dissipation device includes a thermal assembly and at least one fan, and the thermal assembly includes a plurality of covers. Each of the covers is individually disposed on the second surface at a position below one of the light source sets, and an air flow channel is formed between each cover and the bottom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.