LED lamp
US7682055B2 · kind B2 · utility
26Cited by
1References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 1, 2008 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Aug 1, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED lamp includes a bracket and a heat sink mounted on a top side of the bracket. The heat sink includes a base. A plurality of LED module assemblies is mounted to a bottom surface of the base of the heat sink. Each of the LED module assemblies includes a heat absorbing plate located below the bottom surface of the base of the heat sink, an LED module mounted on a bottom surface of the heat absorbing plate and a heat pipe interconnecting the bottom surface of the base and a top surface of the heat absorbing plate. The heat pipes are U-shaped and horizontally positioned and have different heights.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.