Thermal management materials having a phase change dispersion
US7682690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2002 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Oct 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31801
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a polymeric constituent forming a continuous matrix in the layer; and (b) a dispersed constituent forming discrete domains within the matrix, the domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and the domains having a domain transition temperature above normal room temperature from the first domain phase to the second domain phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.