Method for forming a joint
US7682871B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2004 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Oct 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/57
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a joint. A module is introduced including a paper or plastic substrate, an integrated circuit on a chip mounted on the substrate and in electrical contact with contact areas of the module being located on the surface of the substrate. A web is introduced including one circuitry pattern after another provided with contact areas of the circuitry pattern. Settable isotropically conductive adhesive is dispensed on the contact areas of the circuitry pattern. The contact areas of the module are attached to the contact areas of the circuitry pattern by the isotropically conductive adhesive. The isotropically conductive adhesive is cured at the ambient atmospheric pressure. Settable nonconductive adhesive is dispensed at the side of the module in such a manner that the adhesive is sucked underneath the module by capillary forces. The nonconductive adhesive is cured at the ambient atmospheric pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.