Encapsulation circuitry on a substrate
US7682878B2 · kind B2 · utility
0Cited by
21References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2007 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Oct 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.