Maskless nanofabrication of electronic components
US7682970B2 · kind B2 · utility
35Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2006 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Feb 24, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to systems, materials and methods for the formation of conducting, semiconducting, and dielectric layers, structures and devices from suspensions of nanoparticles. Drop-on-demand systems are used in some embodiments to fabricate various electronic structures including conductors, capacitors, FETs. Selective laser ablation is used in some embodiments to pattern more precisely the circuit elements and to form small channel devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.