Doped LZO buffer layers for laminated conductors
US7683010B2 · kind B2 · utility
1Cited by
14References
12Claims
0Family size
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Key dates
| Filing date | Jul 29, 2005 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Jan 20, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/0632
Abstract
A laminated conductor includes a metallic substrate having a surface, a biaxially textured buffer layer supported by the surface of the substrate, the biaxially textured buffer layer comprising LZO and a dopant for mitigating metal diffusion through the LZO, and a biaxially textured conductor layer supported by the biaxially textured buffer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.