Resin composition, resin mold and method for producing the same
US7683117B2 · kind B2 · utility
6Cited by
1References
12Claims
0Family size
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Key dates
| Filing date | Jan 31, 2008 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Apr 30, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes an aliphatic polyester; a second polymer compound other than the aliphatic polyester; and an organic phosphoric acid compound that has a phosphorus content of about 20% by mass or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.