LED package
US7683470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2007 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Jul 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2054
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.