LED chip array module
US7683475B2 · kind B2 · utility
7Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2006 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Oct 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The difficulties encountered in conventional LED multiple chip modules where wire bonding is used to connect the chips to electrodes can be overcome by using an interconnect to connect the chip to electrodes in a module where the interconnect is supported at points along its length other than at endpoints thereof, by a carrier either directly or indirectly. This improves reliability of the interconnect over conventional designs. Preferably, the contacts of the chips, and the electrodes are all within, or do not extend beyond, two parallel planes that are 400 microns apart for a compact design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.