Enhancing the cooling of dual in-line memory modules
US7684196B2 · kind B2 · utility
30Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2008 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | May 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.