Electronic circuit module including chip mounted to multi-layer wiring plate in flip chip manner
US7684206B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2007 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Nov 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides an electronic circuit module capable of reliably mounting a chip to a multi-layer wiring plate in a flip chip manner.In an electronic circuit module according to an embodiment of the invention, a chip including bumps with a height of d is mounted to a multi-layer wiring plate including surface electrodes and internal electrodes in a flip chip manner. In the multi-layer wiring plate, when the minimum thickness of the surface electrode and the internal electrodes overlapping each other below each of the bumps is TD and the maximum thickness of the surface electrode and the internal electrodes overlapping each other in a space surrounded by the bumps is TI, the surface electrodes and the internal electrodes are arranged so as to satisfy TI<TD+d.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.