Process for removing material from a substrate
US7685692B2 · kind B2 · utility
1Cited by
28References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2004 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Dec 4, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0333
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for skiving a substrate is described, wherein the substrate is skived with a roller or a device or apparatus including the roller. The roller provides a cleaner skive than previously known methods without damage to underlying materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.