Sensor element and sensor assembly provided with a casing
US7685881B2 · kind B2 · utility
1Cited by
9References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 27, 2008 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Mar 27, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0069
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor element having a sensitive sensor portion on an upper side of a substrate layer. The upper side of the substrate layer is provided with a recess on the periphery of the sensitive sensor portion. The recess provides mechanical isolation or decoupling of the sensitive sensor portion, as a result of which external forces do not cause stress in the sensitive sensor portion. In addition, a sensor assembly is described which is provided with at least one sensor element and a casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.