Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like
US7685963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2005 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Jan 28, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/016
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a photoresist dispensing apparatus for use in manufacturing a semiconductor device, to coercively emit photoresist from a bottle by using a dispensing pump and to pass it through a supply line and a filter to obtain a filtering operation, and to spray the filtered photoresist to a wafer through a spraying nozzle; a bubble removal unit is equipped with the supply line, before the dispensing pump. Large and micro bubbles generated in the midst of flow of photoresist, and foreign substances, are substantially filtered off so as to supply photoresist of a good quality. A floating load in a foreign substance removal filter is substantially removed, thus spraying photoresist under an always uniform and stabilized pressure by using a dispensing pump, to cover a wafer with photoresist in a uniform thickness and obtain a precise pattern formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.