Lensed dual diode-laser bar package
US7686224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2006 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Jan 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02326
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A diode-laser bar package includes two diode-laser bars mounted on a heat sink with slow-axes of the diode-laser bars aligned. Three spaced apart mounting bosses extend from the front of the heat sink. The package includes two cylindrical lens assemblies. Each lens assembly has an elongated cylindrical lens bonded to a rectangular mounting block. The cylindrical lenses are aligned with the diode-laser bars. Lateral faces of the mounting block are epoxy-bonded to lateral faces of the mounting bosses. Bonding is effected by injecting liquid epoxy between the faces to be bonded though holes extending through the mounting blocks from front to the lateral faces of the mounting blocks. The liquid epoxy is then cured to complete the attachment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.