Composition for removing conductive materials and manufacturing method of array substrate using the same
US7686968B2 · kind B2 · utility
0Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2006 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Jul 31, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/136295
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition for removing a conductive material and a manufacturing method of an array substrate using the composition, wherein the composition may include a nitric acid of about 3 to 15 wt %, a phosphoric acid of about 40 to 70 wt %, an acetic acid of about 5 to 35 wt %. The composition may further include a chlorine compound of about 0.05 to 5 wt %, a chlorine stabilizer of about 0.01 to 5 wt %, a pH stabilizer of about 0.01 to 5 wt %, and water of residual quantity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.