Method for producing laminated dielectric
US7687015B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2005 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Dec 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/162
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for producing a laminated dielectric, which comprises laminating a raw material layer containing a high dielectric constant glass ceramic composition comprising from 30 to 70 mass % of a Ba—Ti compound powder having a Ti/Ba molar ratio of from 3.0 to 5.7 and from 30 to 70 mass % of an alkali free glass powder containing, by mol %, from 15 to 40% of SiO2, from 5 to 37% of B2O3, from 2 to 15% of Al2O3, from 1 to 25% of CaO+SrO, from 5 to 25% of BaO and from 25 to 50% of SiO2+Al2O3, and a raw material layer containing a low dielectric constant glass ceramic composition comprising from 10 to 70 mass % of a ceramic powder and from 30 to 90 mass % of an alkali free glass powder wherein SiO2+Al2O3 is at least 34 mol % and larger by at least 9 mol % than that in the above alkali free glass powder, followed by firing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.