Heat block assembly and organic compound synthesizing apparatus using the heat block assembly
US7687043B2 · kind B2 · utility
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6References
8Claims
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Key dates
| Filing date | Jun 15, 2007 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Jun 11, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01J2219/00725
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A heat block assembly and an organic compound synthesizing apparatus using the heat block assembly are provided. The heat block assembly includes one or more heat blocks provided with grooves in which reaction containers are inserted, and a temperature adjustor for adjusting the temperature of the heat block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.