Positive photosensitive resin composition
US7687208B2 · kind B2 · utility
7Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 10, 2007 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Aug 10, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photosensitive resin composition excellent in sensitivity and resolution, characterized by comprising 100 parts by mass of (A) a hydroxypolyamide comprising repeating units represented by the general formula (1), 1 to 50 parts by mass of (B) a photoacid generator, 5 to 20 parts by mass of (C) a carboxylic acid compound having 6 to 18 carbon atoms as represented by the general formula (2), and 0.01 to 70 parts by mass of (D) an alcohol having 4 to 14 carbon atoms as represented by the general formula (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.