Thermally controlled fluidic self-assembly
US7687277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2004 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Jan 27, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/25
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses are provided for assembling a structure on a support having a pattern of binding sites. In accordance with the method, a first fluid is provided on the surface of the support with the first fluid being of a type that that increases viscosity when cooled, the first fluid having first micro-components suspended therein each adapted to engage the binding sites. First fluid proximate to selected binding sites is cooled to increase the viscosity of the responsive fluid proximate to the selected binding sites so that the first micro-components suspended in the first fluid are inhibited from engaging the selected binding sites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.