Silicone composition and cured silicone resin
US7687587B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2005 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Oct 11, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A silicone composition according to the present invention comprises (A) an organopolysiloxane resin having an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogensilane in an amount sufficient to cure the composition, (C) an effective amount of a reactive diluent comprising (i) an organosiloxane having an average of at least two alkenyl groups per molecule and a viscosity of from 0.001 to 2 Pa·s at 25° C., wherein the viscosity of (C)(i) is not greater than 20% of the viscosity of component (A), and (ii) an organohydrogensiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule and a viscosity of from 0.001 to 2 Pa·s at 25° C., in an amount sufficient to provide from 0.5 to 3 moles of silicon-bonded hydrogen atoms in (C)(ii) to moles of alkenyl groups in (C)(i), and (D) a catalytic amount of a hydrosilylation catalyst; and a cured silicone resin prepared by curing the silicone composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.