Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength
US7687591B2 · kind B2 · utility
11Cited by
83References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2004 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Dec 13, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to silicone compositions suitable for forining pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.