Mounting substrate and microphone mounted thereon
US7687723B2 · kind B2 · utility
4Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2006 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Jun 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.