Patent · US Active

Integrated circuit packages, systems, and methods

US7687905B2 · kind B2 · utility

2Cited by

14References

6Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Brent Stone · Chandler, US
Dustin P. Wood · Chandler, US
Kaladhar Radhakrishnan · Chandler, US

Key dates

Filing date	Feb 28, 2008
Grant date	Mar 30, 2010
Priority date	—
Expiry date	Feb 28, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit package includes a first capacitor supported by a surface of a substrate, and a second capacitor supported by the surface of the substrate. The first capacitor is within a die shadow region, and the second capacitor lies outside of the die shadow region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.