Compliant membrane thin film interposer probe for intergrated circuit device testing
US7688089B2 · kind B2 · utility
4Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2008 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | May 31, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49174
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A probe test head for a high density pin count integrated circuit, includes: a flexible membrane; an array of conductive structures, each one of the structures including a mechanically compliant probe tip affixed to the membrane, such that an attachment point enables mechanical actuation of the probe tip through a conductive member parallel to the membrane. A method for fabrication and measurement apparatus are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.