Patent · US Active

Thermal module and electronic apparatus using the same

US7688590B2 · kind B2 · utility

7Cited by

5References

13Claims

0Family size

Assignee

COMPAL ELECTRONICS, INC. · TW

Inventors

Chau-Wen Cheng · Taipei, TW
Chi-Wei Tien · Taipei, TW
Chang-Yuan Wu · New Taipei, TW
Ya-Ping Lin · Nanhu, CN

Key dates

Filing date	Apr 27, 2008
Grant date	Mar 30, 2010
Priority date	—
Expiry date	Apr 30, 2028

Classification

Technology area (CPC G)Physics
CPC primaryG06F1/203
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.