Thermal testing apparatus
US7690839B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 21, 2007 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Sep 6, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/24
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal testing apparatuses for a server system (22) includes a heating module (16), at least one temperature sensor (191), a micro control unit (MCU) (192), a trigger controlling circuit (193) and a display module (20). The heating module heats airflow at an entry of the server system. The temperature sensor senses temperature at the entry of the server system, and outputs temperature signals. The MCU receives temperature signals and converts them to temperatures in degrees. The trigger controlling circuit is electrically connected to the MCU to receive a controlling signal, and controls turning the heating module on or off. The display module is electrically connected to the MCU for showing the temperatures in degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.