Mold for imprint, process for producing minute structure using the mold, and process for producing the mold
US7690910B2 · kind B2 · utility
5Cited by
1References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 25, 2007 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Apr 28, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A mold for imprint capable of forming a reduced seam or seamless pattern, on a surface of a substrate, having larger area than that of the mold includes a first pattern area comprising a plurality of first recesses; and a second pattern area, comprising a plurality of second recesses, for being used as an alignment mark. The first pattern area and the second pattern area have an equal height at their outermost surfaces. The first recesses and the second recesses have different depths. The first pattern area and the second pattern area have an equal cyclic interval.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.