Printed wiring board and its manufacturing method
US7691189B2 · kind B2 · utility
40Cited by
38References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2007 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Apr 17, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.