Membrane-mediated electropolishing with topographically patterned membranes
US7691250B2 · kind B2 · utility
8Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2006 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Feb 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention provides membrane-mediated electropolishing (MMEP) processes for polishing and/or planarizing metal work pieces using topographically patterned membranes. The processes can be used for both pure metals and alloys, and provide advantages over conventional electropolishing processes and known MMEP processes using smooth membranes. This invention also provides a cathode half-cell and an apparatus useful in membrane-mediated electropolishing processes. The invention also provides processes for electroengraving and electromachining topographic patterns, holes and/or grooves into the surface of a metal work piece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.