Patent · US Active

Moulding compound and method for production thereof

US7691943B2 · kind B2 · utility

5Cited by

0References

20Claims

0Family size

Assignees

EMS-CHEMIE AG · CH
NORMA GERMANY GMBH · DE

Inventors

Botho Hoffmann · Domat/Ems, CH
Georg Stoppelmann · Bonaduz, CH
Janos Kertesz · Hofheim, DE
Hans-Gerhard Fritz · Uhingen, DE
Fan Jin · Stuttgart, DE

Key dates

Filing date	Dec 22, 2006
Grant date	Apr 6, 2010
Priority date	—
Expiry date	Dec 3, 2027

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2312/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Moulding compound, comprising 30 to 80% by weight of a polyamide as a thermoplastic matrix and of a cross-linked, disperse elastomer phase which is bonded to the thermoplastic matrix and contains 10 to 69% by weight of an ethylene copolymer and also 1 to 10% by weight of a compatibility agent, selected from the compounds obtained by means of grafting of α, β, ethylene-unsaturated mono- and/or dicarboxylic acids or derivatives thereof on an ethylene-copolymer-polymer backbone, respectively relative to the moulding compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.