Laser processing device, laser processing head and laser processing method
US7692115B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2007 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Sep 29, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/1476
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a laser processing device. The laser processing device includes a laser beam source irradiating a laser beam, and a laser processing head. The laser processing head includes a transmitting window through which the laser beam passes, an aperture formed in a bottom of the laser head and allowing the laser beam to pass through via the transmitting window, an introducing hole introducing a gas into the laser processing head, and an exhausting hole discharging a gas in the laser processing head to outside. The laser processing head further includes a air hole introducing the gas to the periphery of the laser irradiating area, an air hole allowing to discharge the ambient gas of the laser irradiating area, and a masking shield having an opening placed between the transmitting window and the aperture, and an aerating portion communicated with the introducing hole and exhausting hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.